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    Wireless Transmitter

    Bluetooth Audio SoC

    • General Info
    • Technical Spec
    • Applications
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    General Info

    Actions wireless transmission and transceiver series products provide high integration and high performance Bluetooth audio single chip solutions, integrated Bluetooth radio frequency (RF) and baseband, power management unit (PMU), audio codec and MCU. Can be widely used in all kinds of Bluetooth transceiver integrated products, such as gaming earphones and dongle, wireless microphones, conference speakers dongle, communications headset dongle, TV dongle, game-box dongle, intercom adapters, Bluetooth emission slave module, transceiver integrated module, projector/CD/DVD and various devices that require Bluetooth emission (connect Bluetooth headset or Bluetooth speakers) and other low-latency wireless audio transmission and reception products.

     

    The series integrates Bluetooth radio frequency (RF) and baseband, power management unit (PMU), audio codec and microcontrol unit (MCU) modules. Bluetooth transmit power up to 13dBm, receive sensitivity -96dBm, complete specifications, leading performance. Support one to two (connect two Bluetooth speakers or Bluetooth headsets at the same time), support linein, USB, SPDIF (fiber or coaxial), I2S, MIC, SD/MMC, SPI and other audio input sources, support full-format audio decoding, support screen display, compatible with the market mainstream Bluetooth speakers and Bluetooth headsets, Support HFP AG 16K HD call, support two-way 48K HD voice transmission at the same time, compatible with win7/8.1/10/11/MAC and other mainstream operating systems and mainstream call conference software.

     

    ATS3031 integrates high-quality audio codec, ultra-low delay wireless transmission path, ultra-wideband 32K dual-microphone AI noise reduction, DAC bottom noise is less than 2μV, and the Torch 2.4G private protocol can achieve ultra-low latency (the entire link can be as low as 23ms) when connected through dongle. Provide high-quality audio experience and HD call experience while meeting low latency transmission.

     

    The wireless transmission and transceiver chips are mainly  ATS3031,ATS2831P(L) and ATS2851.

     

    Technical Spec PDF Download

    BT Version
    CPU
    DSP
    RAM
    SPI norflash
    Max TX Power (BR)
    A2DP
    AVRCP
    HFP
    Dual headset connections
    ACT-LL（Low latency）
    Transmit audio input source
    External RF PA
    USB
    Display
    Package
    ATS323X ATS3031 ATS2831P(L) ATS2851
    BT Version V5.4 V5.4 V5.4 V5.4
    CPU ARM STAR MC1 @264MHz ARM M4F @96MHz 32bits RISC @264MHz 32bits RISC @234MHz
    DSP Cadence HiFi5+NN @504MHz CEVA TL420 @170MHz 32bits DSP @342MHz
    RAM Build-in 2.88MB Build-in 632KB Build-in 498KB Build-in 203KB
    SPI norflash Build in 64Mbits Flash Build in 16Mbits Flash Build in 32Mbits Flash Build in 16Mbits Flash
    Max TX Power (BR) 16dBm 13dBm 10dBm 10dBm
    A2DP V1.4 SRC/SNK V1.3.2 SRC/SNK V1.3.2 SRC/SNK V1.3.2 SRC/SNK
    AVRCP V1.6.2 TG/CT V1.6.2 TG/CT V1.6.2 TG/CT V1.6.2 TG/CT
    HFP V1.9 AG/HF V1.8 AG/HF V1.8 AG/HF V1.8 HF
    Dual headset connections
    ACT-LL（Low latency） 13.3ms (5ms LC3+HR) √/24ms（LC3） 23ms（2831P LC3）/ 10ms（2831PL LC3+）
    Transmit audio input source LINEIN/USB/SPDIF/I2S/ MICIN LINEIN/USB/I2S/ MICIN LINEIN/USB/SPDIF/I2S/ MICIN LINEIN/USB/SD/EMMC
    External RF PA
    USB USB2.0 HS DRD USB2.0 FS USB2.0 HS USB2.0 FS
    Display SPI LCD SPI LCD SPI LCD SPI LCD
    Package BGA139（6X5.5mm）/ QFN68 (7X7mm) QFN44 (4X5mm) QFN40 (5X5mm) QFN32 (4X4mm)

    Applications

    • Bluetooth Transmitter
    • Bluetooth transceiver integrated device

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