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    Wireless Transmitter

    Bluetooth® Audio SoC

    • General Info
    • Technical Spec
    • Applications
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    General Info

    Actions wireless transmission and transceiver series products provide high integration and high performance Bluetooth® audio single chip solutions, integrated Bluetooth® radio frequency (RF) and baseband, power management unit (PMU), audio codec and MCU. Can be widely used in all kinds of Bluetooth® transceiver integrated products, such as gaming earphones and dongle, wireless microphones, conference speakers dongle, communications headset dongle, TV dongle, game-box dongle, intercom adapters, Bluetooth® emission slave module, transceiver integrated module, projector/CD/DVD and various devices that require Bluetooth® emission (connect Bluetooth® headset or Bluetooth® speakers) and other low-latency wireless audio transmission and reception products.

     

    The series integrates Bluetooth® radio frequency (RF) and baseband, power management unit (PMU), audio codec and microcontrol unit (MCU) modules. Bluetooth® transmit power up to 13dBm, receive sensitivity -96dBm, complete specifications, leading performance. Support one to two (connect two Bluetooth® speakers or Bluetooth® headsets at the same time), support linein, USB, SPDIF (fiber or coaxial), I2S, MIC, SD/MMC, SPI and other audio input sources, support full-format audio decoding, support screen display, compatible with the market mainstream Bluetooth® speakers and Bluetooth® headsets, Support HFP AG 16K HD call, support two-way 48K HD voice transmission at the same time, compatible with win7/8.1/10/11/MAC and other mainstream operating systems and mainstream call conference software.

     

    ATS3031 integrates high-quality audio codec, ultra-low delay wireless transmission path, ultra-wideband 32K dual-microphone AI noise reduction, DAC bottom noise is less than 2μV, and the Torch 2.4G private protocol can achieve ultra-low latency (the entire link can be as low as 23ms) when connected through dongle. Provide high-quality audio experience and HD call experience while meeting low latency transmission.

     

    The wireless transmission and transceiver chips are mainly  ATS3031,ATS2831P(L) and ATS2851.

     

    Technical Spec PDF Download

    Bluetooth® Version
    CPU
    DSP
    AI
    RAM
    SPI norflash
    Max TX Power (BR)
    LE Audio
    NGPP-2.4 Low latency（end to end）
    Transmit audio input source
    USB
    Display
    Memory
    Connection Mode
    Package
    ATS323X ATS3031 ATS2831P(L) ATS2851
    Bluetooth® Version Bluetooth® Core 5.4 Bluetooth® Core 5.4 Bluetooth® Core 5.4 Bluetooth® Core 5.4
    CPU ARM STAR MC1 @264MHz ARM M4F @96MHz 32bits RISC @264MHz 32bits RISC @234MHz
    DSP Cadence HiFi5+NN @504MHz CEVA TL420 @170MHz 32bits DSP @342MHz
    AI √ (up to 100Gops)
    RAM Build-in 2.88MB Build-in 632KB Build-in 498KB Build-in 203KB
    SPI norflash Build in 64Mbits Flash Build in 16Mbits Flash Build in 32Mbits Flash Build in 16Mbits Flash
    Max TX Power (BR) 16dBm 13dBm 10dBm 10dBm
    LE Audio
    NGPP-2.4 Low latency（end to end） 9ms (2.5ms LC3+HR) √/23ms（NAV） 23ms（2831P NAV）/ 10ms（2831PL LC3+）
    Transmit audio input source LINEIN/USB/SPDIF/I2S/ MICIN LINEIN/USB/I2S/ MICIN LINEIN/USB/SPDIF/I2S/ MICIN LINEIN/USB/SD/EMMC
    USB USB2.0 HS DRD USB2.0 FS USB2.0 FS USB2.0 FS
    Display SPI LCD Built in display accelerator, up to 466*466 60fps SPI LCD SPI LCD SPI LCD
    Memory SDIO/ EMMC SDIO/ EMMC
    Connection Mode 2T1R, 4T1R, 2T4R, 1TNR 2T1R, 4T1R, 2T4R 2T1R, 1T2R 1T2R
    Package QFN80 (8*8mm)/ QFN68 (7X7mm) QFN44 (4X5mm) QFN40 (5X5mm) QFN32 (4X4mm)

    Applications

    • Bluetooth® Transmitter
    • Bluetooth® transceiver integrated device

    Contact sales

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